Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12080622 | Semiconductor structure and method of wafer bonding | Chia-Liang Liao, Purakh Raj Verma, Chee-Hau Ng | 2024-09-03 |
| 11955292 | Parallel-connected trench capacitor structure with multiple electrode layers and method of fabricating the same | Purakh Raj Verma, Xingxing Chen, Chao Jin | 2024-04-09 |
| 11929213 | Parallel-connected trench capacitor structure with multiple electrode layers and method of fabricating the same | Purakh Raj Verma, Xingxing Chen, Chao Jin | 2024-03-12 |
| 11923373 | Semiconductor structure | Bo Tao, Li-Cih Wang, Purakh Raj Verma, Zhibiao Zhou, Dong Yin +2 more | 2024-03-05 |
| 11881529 | Semiconductor device and method of fabricating the same | Purakh Raj Verma, Li-Cih Wang, Kai Cheng | 2024-01-23 |