Issued Patents 2024
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12132011 | Integrated circuit device and fabrication method thereof | Kuo-Yuh Yang, Chia-Huei Lin, Chu-Chun Chang | 2024-10-29 |
| 12131976 | Semiconductor structure with heat dissipation structure and method of fabricating the same | Kuo-Yuh Yang, Chia-Huei Lin | 2024-10-29 |
| 12087712 | Method for fabricating an integrated circuit device | Kuo-Yuh Yang, Chia-Huei Lin, Chu-Chun Chang | 2024-09-10 |
| 12080622 | Semiconductor structure and method of wafer bonding | Chia-Liang Liao, Ching-Yang Wen, Chee-Hau Ng | 2024-09-03 |
| 12046659 | Semiconductor structure and manufacturing method thereof | Su Xing | 2024-07-23 |
| 11955292 | Parallel-connected trench capacitor structure with multiple electrode layers and method of fabricating the same | Ching-Yang Wen, Xingxing Chen, Chao Jin | 2024-04-09 |
| 11929213 | Parallel-connected trench capacitor structure with multiple electrode layers and method of fabricating the same | Ching-Yang Wen, Xingxing Chen, Chao Jin | 2024-03-12 |
| 11923373 | Semiconductor structure | Bo Tao, Li-Cih Wang, Ching-Yang Wen, Zhibiao Zhou, Dong Yin +2 more | 2024-03-05 |
| 11881529 | Semiconductor device and method of fabricating the same | Ching-Yang Wen, Li-Cih Wang, Kai Cheng | 2024-01-23 |