Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12131976 | Semiconductor structure with heat dissipation structure and method of fabricating the same | Purakh Raj Verma, Chia-Huei Lin | 2024-10-29 |
| 12132011 | Integrated circuit device and fabrication method thereof | Purakh Raj Verma, Chia-Huei Lin, Chu-Chun Chang | 2024-10-29 |
| 12087712 | Method for fabricating an integrated circuit device | Purakh Raj Verma, Chia-Huei Lin, Chu-Chun Chang | 2024-09-10 |
| 11894439 | Semiconductor device | Heng-Ching Lin, Yu-Teng Tseng, Chu-Chun Chang, Chia-Huei Lin | 2024-02-06 |