Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12150264 | Electronic device including clad components | Hoishun Li, Todd S. Mintz, Isabel Yang, James A. Curran, Lei Gao +2 more | 2024-11-19 |
| 12114453 | Core shell with various filler materials for enhanced thermal conductivity | William A. Counts, Andrew W. Meschke, Lei Gao, Alexander W. Williams, Hoishun Li +3 more | 2024-10-08 |
| 12070797 | Direct metal deposition of electronic device components | Anthony D. Prescenzi, Adam T. Clavelle, Eric W. Hamann, Isabel Yang, Brian M. Gable +1 more | 2024-08-27 |