Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11929259 | Method for manufacturing leadless semiconductor package with wettable flanks | Ian Harvey Arellano, Aaron Cadag | 2024-03-12 |
| 11916090 | Tapeless leadframe package with exposed integrated circuit die | Aaron Cadag, Rohn Kenneth Serapio | 2024-02-27 |