Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11929259 | Method for manufacturing leadless semiconductor package with wettable flanks | Aaron Cadag, Ela Mia Cadag | 2024-03-12 |
| 11862579 | Semiconductor device having cavities at an interface of an encapsulant and a die pad or leads | — | 2024-01-02 |