Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11916090 | Tapeless leadframe package with exposed integrated circuit die | Aaron Cadag, Ela Mia Cadag | 2024-02-27 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11916090 | Tapeless leadframe package with exposed integrated circuit die | Aaron Cadag, Ela Mia Cadag | 2024-02-27 |