Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12112992 | Package having an electronic component and an encapsulant encapsulating a dielectric layer and a semiconductor die of the electronic component | Daniel Porwol, Thomas Fischer, Anton Steltenpohl | 2024-10-08 |
| 11948802 | Methods and devices related to radio frequency devices | Hans Taddiken, Christian Butschkow, Andrea Cattaneo, Henning Feick, Dominik Heiss +3 more | 2024-04-02 |