Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12148640 | Method and apparatus for use in wafer processing | Gerald Lackner, Walter Leitgeb, Michael Lecher | 2024-11-19 |
| 12112992 | Package having an electronic component and an encapsulant encapsulating a dielectric layer and a semiconductor die of the electronic component | Daniel Porwol, Uwe Seidel, Anton Steltenpohl | 2024-10-08 |
| 11976507 | Method for allocating operating parameters to local control units intended to control a door movement in a motor vehicle | Florian Pohl, Udo Geuther, Rene Bekendam | 2024-05-07 |
| 11947001 | Measurement setup, reference reflector as well as method for measuring attenuation | Sherif Ahmed, Frank Gumbmann, Tobias Koeppel, Michael Freissl, Christian Evers | 2024-04-02 |