Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12112992 | Package having an electronic component and an encapsulant encapsulating a dielectric layer and a semiconductor die of the electronic component | Thomas Fischer, Uwe Seidel, Anton Steltenpohl | 2024-10-08 |