Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183667 | Semiconductor package with power electronics carrier having trench spacing adapted for delamination | Adrian Lis, Christian Neugirg | 2024-12-31 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183667 | Semiconductor package with power electronics carrier having trench spacing adapted for delamination | Adrian Lis, Christian Neugirg | 2024-12-31 |