Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183667 | Semiconductor package with power electronics carrier having trench spacing adapted for delamination | Peter Scherl, Christian Neugirg | 2024-12-31 |
| 12113000 | Lead adapters for semiconductor package | Ajay Pai, Tino Karczewski | 2024-10-08 |
| 12062589 | Semiconductor packages including recesses to contain solder | Michael Ledutke | 2024-08-13 |