Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183667 | Semiconductor package with power electronics carrier having trench spacing adapted for delamination | Peter Scherl, Adrian Lis | 2024-12-31 |
CN
Christian Neugirg
Overall (2024): #508,402 of 561,600Top 95%
1
Patents 2024