Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183696 | Semiconductor device including bonding pad metal layer structure | Evelyn Napetschnig, Jens Brandenburg, Christoffer Erbert, Joachim Hirschler, Oliver Humbel +2 more | 2024-12-31 |
| 12046509 | Semiconductor device protection using an anti-reflective layer | Stephan Voss, Alexander Breymesser, Eva-Maria Hof, Mathias Plappert | 2024-07-23 |