Issued Patents 2024
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183794 | MOSFET gate shielding using an angled implant | Samphy Hong | 2024-12-31 |
| 12087585 | Low-temperature implant for buried layer formation | Samphy Hong, Wei Zou, Judy Campbell Soukup | 2024-09-10 |
| 12046473 | Backside wafer dopant activation | Samphy Hong, Vittoriano Ruscio, Wei Zou, David J. Lee | 2024-07-23 |
| 11955533 | Ion implantation to reduce nanosheet gate length variation | Sipeng Gu, Baonian Guo, Wei Zou, Kyuha Shim | 2024-04-09 |
| 11948799 | Minority carrier lifetime reduction for SiC IGBT devices | Wei Zou | 2024-04-02 |
| 11942324 | Method for BEOL metal to dielectric adhesion | Jun Lu, Ting Cai, Ma Ning, Weiye He, Jian Kang | 2024-03-26 |
| 11882695 | Vertical field effect transistor including integrated antifuse | Kangguo Cheng, Juntao Li, Geng Wang | 2024-01-23 |
| 11881405 | Methods for forming N-type buried layer in a substrate by performing non-doping implant through oxide layer formed over the substrate | Wei Zou | 2024-01-23 |
| 11875995 | Techniques and apparatus for anisotropic stress compensation in substrates using ion implantation | Scott Falk, Jun Lu | 2024-01-16 |