Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12148635 | Cleave systems having spring members for cleaving a semiconductor structure and methods for cleaving such structures | — | 2024-11-19 |
| 12104275 | Ingot puller apparatus having cooling jacket device with cooling fluid tubes | Benjamin Michael Meyer | 2024-10-01 |
| 12019031 | Cleaved semiconductor wafer imaging system | Benjamin Michael Meyer, John F. Valley, James Dean Eoff, Vandan Tanna, William L. Luter | 2024-06-25 |
| 11921054 | Cleaved semiconductor wafer camera system | Benjamin Michael Meyer, John F. Valley, James Dean Eoff, Vandan Tanna, William L. Luter | 2024-03-05 |