Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12148631 | Semiconductor module, method for manufacturing semiconductor module, and level different jig | Takashi Masuzawa, Hiromichi Gohara | 2024-11-19 |
| 11935774 | Assembly jig set and manufacturing method of semiconductor module | Takeshi Yokoyama, Masaki Maruyama | 2024-03-19 |