Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11935774 | Assembly jig set and manufacturing method of semiconductor module | Kazunaga Onishi, Masaki Maruyama | 2024-03-19 |
| 11890702 | Solder joint | Hirohiko Watanabe, Shunsuke Saito | 2024-02-06 |