Issued Patents 2024
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12148631 | Semiconductor module, method for manufacturing semiconductor module, and level different jig | Kazunaga Onishi, Takashi Masuzawa | 2024-11-19 |
| 12127382 | Semiconductor module with cooling fins in a matrix form | Yoshihiro TATEISHI, Tatsuhiko Asai, Takahiro Koyama | 2024-10-22 |
| 12087655 | Semiconductor apparatus and vehicle | Yuta Tamai, Takafumi Yamada | 2024-09-10 |
| 12074091 | Semiconductor device with cooler including heat dissipating substrate having a plurality of fins bonded to reinforcing plate | Takahiro Koyama | 2024-08-27 |
| 12072155 | Heat exchanger having cured edge | Akihito Aoki, Eiji Anzai, Yoshinari Ikeda, Ryoichi Kato, Michihiro Inaba +1 more | 2024-08-27 |
| 11996350 | Cooler and semiconductor apparatus | Yoshihiro TATEISHI, Takahiro Koyama | 2024-05-28 |
| 11908772 | Semiconductor module and vehicle | Takafumi Yamada | 2024-02-20 |