Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12154885 | Method and structure for die bonding using energy beam | Min-Hsun Hsieh, Shih-An Liao, Hsin-Mao Liu, Tzu-Hsiang Wang, Chi-Chih Pu | 2024-11-26 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12154885 | Method and structure for die bonding using energy beam | Min-Hsun Hsieh, Shih-An Liao, Hsin-Mao Liu, Tzu-Hsiang Wang, Chi-Chih Pu | 2024-11-26 |