Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12154885 | Method and structure for die bonding using energy beam | Min-Hsun Hsieh, Shih-An Liao, Ying-Yang SU, Hsin-Mao Liu, Chi-Chih Pu | 2024-11-26 |
| 12107080 | Light-emitting device, manufacturing method thereof and display module using the same | Min-Hsun Hsieh | 2024-10-01 |
| 11955589 | Light-emitting device, manufacturing method thereof and display module using the same | Min-Hsun Hsieh | 2024-04-09 |