Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12154885 | Method and structure for die bonding using energy beam | Min-Hsun Hsieh, Ying-Yang SU, Hsin-Mao Liu, Tzu-Hsiang Wang, Chi-Chih Pu | 2024-11-26 |
| 12119321 | Semiconductor device and a method of manufacturing thereof | Shau-Yi Chen, Ming-Chi Hsu, Chun-Hung Liu, Min-Hsun Hsieh | 2024-10-15 |