Issued Patents 2024
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12167567 | Fan silencer module | Yongguo Chen, Yaotsan Tsai, Hua Yang, Xin Mao | 2024-12-10 |
| 12160979 | Compressible thermal link | Chejung Liu, Ravinandana Mysore Ramachandra Rao | 2024-12-03 |
| 12156324 | Thermal Interface Material (TIM) filling structure for high warpage chips | Yongguo Chen, Yaotsan Tsai, Hua Yang | 2024-11-26 |
| 12075588 | Ejector for field replaceable module | Wei Qi | 2024-08-27 |
| 12022639 | Induced air convection cooling for computing or networking devices | Chejung Liu | 2024-06-25 |