Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12160979 | Compressible thermal link | Ravinandana Mysore Ramachandra Rao, Vic Hong Chia | 2024-12-03 |
| 12022639 | Induced air convection cooling for computing or networking devices | Vic Hong Chia | 2024-06-25 |