Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12167567 | Fan silencer module | Vic Hong Chia, Yaotsan Tsai, Hua Yang, Xin Mao | 2024-12-10 |
| 12156324 | Thermal Interface Material (TIM) filling structure for high warpage chips | Yaotsan Tsai, Vic Hong Chia, Hua Yang | 2024-11-26 |