Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12051562 | Method, apparatus, and system for wafer grounding | Yixiang Wang, Shibing Liu, Shanhui Cao, Kangsheng Qiu, Juying Dou +4 more | 2024-07-30 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12051562 | Method, apparatus, and system for wafer grounding | Yixiang Wang, Shibing Liu, Shanhui Cao, Kangsheng Qiu, Juying Dou +4 more | 2024-07-30 |