Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12051562 | Method, apparatus, and system for wafer grounding | Yixiang Wang, Shibing Liu, Shanhui Cao, Kangsheng Qiu, Ying Luo +4 more | 2024-07-30 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12051562 | Method, apparatus, and system for wafer grounding | Yixiang Wang, Shibing Liu, Shanhui Cao, Kangsheng Qiu, Ying Luo +4 more | 2024-07-30 |