Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12159804 | Tungsten molybdenum structures | Xi Cen, Dixiong WANG, Yi Luo | 2024-12-03 |
| 12113020 | Formation of metal vias on metal lines | Ryan Smith, Nicolas L. Breil | 2024-10-08 |
| 12094773 | Methods for low resistivity and stress tungsten gap fill | Xi Cen, Min Heon, Wei Min Chan, Tom Ho Wing Yu, Peiqi WANG +4 more | 2024-09-17 |
| 12037682 | Methods for forming low resistivity tungsten features | Peiqi WANG, Cheng-Liang Cheng, Insu HA, Sang Jin Lee | 2024-07-16 |
| 12014956 | Tungsten gapfill using molybdenum co-flow | Xi Cen | 2024-06-18 |
| 11859277 | Catalyst enhanced molybdenum deposition and gap fill | Xi Cen, Seshadri Ganguli, Xinming Zhang, Norman L. Tam, Abhilash J. Mayur | 2024-01-02 |