JL

Jingmei Liang

Applied Materials: 3 patents #297 of 1,809Top 20%
Overall (2024): #81,570 of 561,600Top 15%
3
Patents 2024

Issued Patents 2024

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
12094709 Plasma treatment process to densify oxide layers Jung Chan Lee, Mun Kyu Park, Jun Seok Lee, Euhngi Lee, Kyu-Ha Shim +5 more 2024-09-17
12046508 Method of dielectric material fill and treatment Shi YOU, He Ren, Naomi Yoshida, Nikolaos Bekiaris, Mehul Naik +2 more 2024-07-23
11967524 3D NAND gate stack reinforcement Praket P. Jha, Shuchi Sunil Ojha, Abhijit Basu Mallick, Shankar Venkataraman 2024-04-23