Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12001193 | Apparatus for environmental control of dies and substrates for hybrid bonding | Ying Wang, Xundong Dai, Guan Huei See, Ruiping Wang, Michael R. Rice +1 more | 2024-06-04 |
| 11948783 | Dynamic phased array plasma source for complete plasma coverage of a moving substrate | Mukund Srinivasan | 2024-04-02 |
| 11923172 | Paired dynamic parallel plate capacitively coupled plasmas | Tsutomu Tanaka, Mandyam Sriram, Dmitry A. Dzilno, Sanjeev Baluja, Mario David Silvetti | 2024-03-05 |