Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11986922 | Techniques for combining CMP process tracking data with 3D printed CMP consumables | Jason Garcheung Fung, Rajeev Bajaj, Daniel Redfield, Mario CORNEJO, Gregory E. Menk +1 more | 2024-05-21 |
| 11911870 | Polishing pads for high temperature processing | Sivapackia Ganapathiappan, Rajeev Bajaj, Yingdong Luo, You Wang, Daniel Redfield | 2024-02-27 |