Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12114453 | Core shell with various filler materials for enhanced thermal conductivity | William A. Counts, Andrew W. Meschke, Lei Gao, Abhijeet Misra, Alexander W. Williams +3 more | 2024-10-08 |
| 12003657 | Handheld electronic device | Richard H. Koch, Jonathan Lee, Laura M. Burke, Ekaterina Pease, Nicholas Merz +5 more | 2024-06-04 |