Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12033910 | Wafer-level stack chip package and method of manufacturing the same | Yeong Beom Ko, Dong Jin Kim | 2024-07-09 |
| 11961867 | Electronic device package and fabricating method thereof | Jin Young Kim, No Sun Park, Yoon Joo Kim, Seung Jae Lee, Sung Kyu Kim +1 more | 2024-04-16 |