Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11961867 | Electronic device package and fabricating method thereof | Jin Young Kim, No Sun Park, Seung Jae Lee, Se Woong Cha, Sung Kyu Kim +1 more | 2024-04-16 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11961867 | Electronic device package and fabricating method thereof | Jin Young Kim, No Sun Park, Seung Jae Lee, Se Woong Cha, Sung Kyu Kim +1 more | 2024-04-16 |