Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12033910 | Wafer-level stack chip package and method of manufacturing the same | Dong Jin Kim, Se Woong Cha | 2024-07-09 |
| 11901332 | Semiconductor device and manufacturing method thereof | Jin Han Kim, Dong Jin Kim, Do Hyung Kim, Glenn Rinne | 2024-02-13 |