Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12136613 | Chip package with near-die integrated passive device | Li-Sheng Weng, Hong Shi | 2024-11-05 |
| 12027493 | Fanout integration for stacked silicon package assembly | Jaspreet S. Gandhi | 2024-07-02 |