Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12136613 | Chip package with near-die integrated passive device | Li-Sheng Weng, Suresh Ramalingam | 2024-11-05 |
| 11950358 | Integrated circuit package with voltage droop mitigation | Frank Lambrecht, Brian D. Philofsky, Prasun K. Raha | 2024-04-02 |