Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12033980 | Thermal pads between stacked semiconductor dies and associated systems and methods | Michel Koopmans | 2024-07-09 |
| 12027493 | Fanout integration for stacked silicon package assembly | Suresh Ramalingam | 2024-07-02 |
| 11901300 | Universal interposer for a semiconductor package | Brian C. Gaide | 2024-02-13 |