Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12112965 | Wafer supporting mechanism and method for wafer dicing | Bo Chen, Fu Tang Chu, Wen-Pin Huang | 2024-10-08 |
| 12015085 | Method of manufacturing a semiconductor device including etching polysilicon | Chia-Chi Yu, Chih-Teng Liao, Yu-Li Lin, Chih Hsuan Cheng, Tzu-Chan Weng | 2024-06-18 |