Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12112965 | Wafer supporting mechanism and method for wafer dicing | Yan-Ting Shen, Fu Tang Chu, Wen-Pin Huang | 2024-10-08 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12112965 | Wafer supporting mechanism and method for wafer dicing | Yan-Ting Shen, Fu Tang Chu, Wen-Pin Huang | 2024-10-08 |