Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12184266 | Electronic package structure | Chi-Sheng Tseng, Ching-Han Huang, Kuo-Hua LAI, Hui-Chung Liu | 2024-12-31 |
| 12168605 | Semiconductor device package and a method of manufacturing the same | Hsu-Liang Hsiao, Ching-Han Huang, Chia-Hung Shen | 2024-12-17 |
| 12085768 | Optical module | Shih-Chieh Tang, Yu-Che Huang, Ying-Chung Chen | 2024-09-10 |