Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12168605 | Semiconductor device package and a method of manufacturing the same | Hsu-Liang Hsiao, Lu-Ming Lai, Ching-Han Huang | 2024-12-17 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12168605 | Semiconductor device package and a method of manufacturing the same | Hsu-Liang Hsiao, Lu-Ming Lai, Ching-Han Huang | 2024-12-17 |