Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12184266 | Electronic package structure | Chi-Sheng Tseng, Lu-Ming Lai, Kuo-Hua LAI, Hui-Chung Liu | 2024-12-31 |
| 12168605 | Semiconductor device package and a method of manufacturing the same | Hsu-Liang Hsiao, Lu-Ming Lai, Chia-Hung Shen | 2024-12-17 |
| 11973048 | Semiconductor package and method for manufacturing the same | An-Nong Wen, Ching-Ho Chang | 2024-04-30 |