Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12185047 | Wearable component, ear tip, and method of manufacturing a wearable component | Chang-Yi Wu, Jenchun Chen | 2024-12-31 |
| 12105892 | Electronic device | Yi-Lun Lai, Cheng-Hui Wu, Huan-Hsun Huang, Yi-Ou Wang | 2024-10-01 |
| 12051658 | Semiconductor package structure and method for manufacturing the same | Cheng-Yuan KUNG | 2024-07-30 |
| 11935841 | Semiconductor package structure and method for manufacturing the same | Cheng-Yuan KUNG, Meng-Wei Hsieh, Yu-Pin Tsai | 2024-03-19 |