Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12051658 | Semiconductor package structure and method for manufacturing the same | Hung-Yi Lin | 2024-07-30 |
| 11935841 | Semiconductor package structure and method for manufacturing the same | Hung-Yi Lin, Meng-Wei Hsieh, Yu-Pin Tsai | 2024-03-19 |
| 11923825 | Semiconductor device and method for manufacturing the same | Meng-Wei Hsieh | 2024-03-05 |