Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12009313 | Semiconductor package shielding structure | Meng-Jen Wang, Hung Chen Kuo, Ying WEI, Chia-Feng Hsu, Yuan-Long Chiao | 2024-06-11 |
| 11887967 | Semiconductor device package and method of manufacturing the same | Shang-Ruei Wu, Meng-Jen Wang, Chen-Tsung Chang, Chih-Fang Wang, Cheng-Han Li +3 more | 2024-01-30 |