Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12068259 | Semiconductor device package and method of manufacturing the same | Wei-Da Lin, Meng-Jen Wang, Wen Jin Huang | 2024-08-20 |
| 12009313 | Semiconductor package shielding structure | Meng-Jen Wang, Chien-Yuan Tseng, Ying WEI, Chia-Feng Hsu, Yuan-Long Chiao | 2024-06-11 |