Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11887967 | Semiconductor device package and method of manufacturing the same | Shang-Ruei Wu, Chien-Yuan Tseng, Meng-Jen Wang, Chih-Fang Wang, Cheng-Han Li +3 more | 2024-01-30 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11887967 | Semiconductor device package and method of manufacturing the same | Shang-Ruei Wu, Chien-Yuan Tseng, Meng-Jen Wang, Chih-Fang Wang, Cheng-Han Li +3 more | 2024-01-30 |