Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11745299 | Grinding method of composite substrate including resin and grinding apparatus thereof | Eiichi Yamamoto, Tsubasa BANDO, Satoru Ide | 2023-09-05 |
| 11742170 | Fuse puller accommodating structure and an electrical junction box | Yosuke Ogawa | 2023-08-29 |
| 11735411 | Method and apparatus for manufacturing semiconductor device | Eiichi Yamamoto, Tsubasa BANDO | 2023-08-22 |