Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11745299 | Grinding method of composite substrate including resin and grinding apparatus thereof | Eiichi Yamamoto, Takahiko Mitsui, Satoru Ide | 2023-09-05 |
| 11735411 | Method and apparatus for manufacturing semiconductor device | Eiichi Yamamoto, Takahiko Mitsui | 2023-08-22 |